In response to new heat-management challenges arising from the higher frequencies, power, and miniaturization of components, Momentive scientists have developed and continue to enhance an extensive portfolio of thermal management materials.
The excellent thermal conductivity and consistent, long-term heat transfer performance typically help enable devices to operate more efficiently and reliably. Our products, which include grease compounds, adhesives, encapsulants and potting compounds, liquid dispensed thermal pads, and high thermal gap fillers are also typically characterized by excellent workability, thin bond lines and minimal weight loss at elevated temperatures.
These materials can support a range of applications, such as:
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