Momentive Performance Materials family of SilCool thermally conductive adhesives can help deliver thin bond lines that contribute to low thermal resistance, and provide excellent adhesion and reliability. This series of heat-cured adhesives excel in thermal interface applications that demand good structural adhesion. Examples include spreaders and heat generators, and thermal interfaces to heat sinks in TIM2 applications.
See More About Our Thermal Management Adhesives
Other thermal adhesives from Momentive offer the process convenience of 1-part condensation cure with moderate heat dissipation. Potential applications include board assemblies and sealants in power modules and sensors.
SilCool* Silicone Adhesive - Addition Cure
The SilCool series silicone adhesives from Momentive Performance Materials offer 1-part, heat curable materials that bond well to a wide variety of substrates without the need for primers. They offer outstanding thermal conductivity, low thermal resistance, excellent dielectric properties, and low stress. SilCool adhesives are excellent candidates for applications presented with heat management challenges that arise from the higher frequencies, power, and miniaturization in today’s electronic devices. Able to efficiently conduct heat, these materials have shown to be valuable additions to semiconductor packages that incorporate heat generating chips, heat spreaders, and heat sinks (TIM1 & TIM2).
Key Features and Typical Benefits
- High workability – to help meet the demands of automated dispensing, screen printing, and stamping applications
- Fast cure & good adhesion
- High thermal conductivity
- Low thermal resistance
- Wide operating temperature range
- Compatible with high-temperature lead-free processing
- Minimal ionic impurities & excellent dielectric properties
Product Details
| Properties | TIA350R | TIA260R | XE13-C1862PT | TSE3281-G | |
|---|---|---|---|---|---|
| Features | High thermal conductivity, low temperature fast cure | Good thermal conductivity, low temperature fast cure | Good thermal conductivity, high elongation | - | |
| Type | 1 part | 1 part | 1 part | 1 part | |
| Property (uncured) | Flowable | Flowable | Flowable | Flowable | |
| Color | Gray | Gray | Gray | Gray | |
| Viscosity (23°C) | Pa.s | 67 | 70 | 55 | 60 |
| Cure Condition | °C/h | 120/0.5 | 120/0.5 | 150/1 | 150/1 |
| Thermal Conductivity2 | W/m.K | 3.5 | 2.5 | 2.5 | 1.7 |
| Thermal Resistance2 | (BLT) mm2.K/W | 24 (60μm) | 25 (50μm) | 25 (50μm) | 35 (50μm) |
| Specific Gravity (23°C) | 3.1 | 2.89 | 2.87 | 2.70 | |
| Hardness (Type A) | 77 | 55 | 65 | 84 | |
| Tensile Strength | Mpa | 1.6 | 1.1 | 1.5 | 4.5 |
| Elongation | % | 20 | 40 | 80 | 50 |
| Adhesion (Al lap shear) | MPa | 1.0 | 0.8 | 1.0 | 2.5 |
| CTE | ppm/K | 115 | 130 | 130 | 140 |
| Glass Transition Temp. | °C | -120 | -120 | -120 | -120 |
| Volume Resistivity | MΩ.m | 4.8x106 | 4.8x106 | 4.8x106 | 4.8x106 |
| Dielectric Strength | kV/mm | 20 | 20 | 20 | 15 |
| Volatile Siloxane (D4-D10) | ppm | <150 | <200 | <200 | - |
| Ionic Content3 (Na+/K+/Cl-) | ppm | each <5 | each <5 | each <5 | each <10 |
| Moisture Absorption | wt% | <0.6 | <0.6 | <0.6 | <0.6 |
1Hot wire method, 2Laser flash analysis on Si-Si sandwiched material, 3Ion chromotography analysis on water extracts *4 Impressed voltage: 100V Typical properties are average data and are to be used as or to develop specifications.
(Charts) Thermal Resistance is proportional to the thickness of the material through which the heat must travel. Increases in pressure during the component assembly process are known to contribute to reductions in thickness of the thermal interface (BLT), and subsequently, reduced thermal resistance.
Silicone Adhesive - Condensation Cure
Momentive Performance Materials offers a range of thermally conductive condensation cure adhesives and sealants. These materials cure to form an elastic rubber when exposed to atmospheric moisture at room temperatures, eliminating the need for heat ovens. The result is a unique combination of process efficiency and excellent thermal conductivity. Our condensation-cure adhesives and sealants are commonly applied in board assembly and sensor applications that require moderate thermal management performance and ease of use.
Product Details
| Properties | TIA0260 | TIA0220 | XE11-B5320 | |
|---|---|---|---|---|
| Features | High thermal conductivity, strong adhesion | High thermal conductivity, strong adhesion | Fast tack free time, UL certified | |
| Type | 1 part | 1 part | 1 part | |
| Property (uncured) | Semi-Flowable | Semi-Flowable | Semi-Flowable | |
| Color | Light Gray | Gray | White | |
| Viscosity (23°C) | Pa.s | 150 | 300 | - |
| Tack Free Time | min | 10 | 10 | 5 |
| Thermal Conductivity1 | W/m.K | 2.6 | 2.2 | 1.3 |
| Thermal Resistance2 | (BLT) mm2.K/W | 18 (50μm) | 25 (50μm) | 35 (50μm) |
| Specific Gravity (23°C) | 3.01 | 2.87 | 2.59 | |
| Hardness (Type A) | 90 | 88 | 80 | |
| Tensile Strength | Mpa | 4.8 | 5.2 | 3.6 |
| Elongation | % | 20 | 40 | 40 |
| Adhesive Strength | MPa | 3.0 | 4.2 | 1.3 |
| CTE | ppm/K | 100 | 110 | 120 |
| Glass Transition Temp. | °C | -120 | -120 | -120 |
| Volume Resistivity | MΩ.m | 7.0x106 | 1.0x107 | 2.0x107 |
| Dielectric Strength | kV/mm | 20 | 20 | 17 |
| Volatile Siloxane (D4-D10) | ppm | 10 | 20 | 100 |
| Flame Retardancy | UL94 HB |
1Hot wire method, 2Laser flash analysis on Si-Si sandwiched material Typical property data values should not be used as specifications
