Faster processing speeds, more stringent performance requirements, and miniaturization in many electronic applications are some of the factors driving demand for new solutions to help meet thermal management challenges. Momentive’s SilCool* ultra-high thermally conductive gap fillers are liquid dispensed silicone materials available in thermal conductivities up to 10 W/m.K. These high thermal conductivities can help solve heat dissipation challenges and provide designers of electronic components with greater design flexibility to achieve performance expectations.
Key Features and Typical Benefits
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High thermal conductivity
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Electrically insulative properties
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Dispensability (easy conformity to 3 dimensional PCB designs)
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Softness, stress- absorption
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Repairability
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Resistance to cracking and sagging (when assembled in typical vertical positions)
Typical Physical Properties
|
Product Characteristics |
unit |
SilCool TIA2101GF gap filler |
|
Type |
2 Component |
|
|
Thermal Conductivity(1) |
W/m.K |
10.1 |
|
Volume Resistivity |
Ω.cm |
3 x 1013 |
|
Dielectric Strength |
kV/mm |
15 |
|
Low Volatile Siloxane (D4~D10) |
ppm |
<100 |
|
Mixing Ratio |
1:1 |
|
|
Cure Condition (at 23℃) |
h |
24 |
Typical properties are average data and are not to be used as or to develop specifications.
1. Hot Disk method
