Long-term, reliable protection of sensitive electronic components is essential to many electronic applications today. Increasingly small systems and rising circuit densities have resulted in hotter operating temperatures, and driven demand for high-performance solutions for heat dissipation.
Designers confronting these challenges will find a range of solutions from Momentive Performance Materials. Our SilCool* family of silicone adhesives and compounds deliver the high thermal conductivity, thin bond lines, and low thermal resistance required for high-performance components. For applications requiring moderate level thermal management, Momentive offers a selection of standard-grade silicone adhesives, encapsulants, and potting materials.
Thermal Management Silicone Products
- Silicones for Smartphones and Mobile Devices
- Silicones for Telecommunications
- Thermal Gap Filler Liquid Dispensed Pad
- Thermal Management Solutions for Automotive
- Thermally Conductive Encapsulants & Potting Compounds
- Thermally Conductive Silicone Adhesives
- Thermally Conductive Silicone Grease Compounds/Pastes
Key Features of Our Silicone Adhesives, Compounds, and Encapsulants
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Typical Benefits of Our Silicone Adhesives, Compounds, and Encapsulants
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Potential Applications of Our Silicone Adhesives, Compounds, and Encapsulants
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Thermal Management Materials Typical Physical Properties
(selected grades only; please contact us for material selection support)
| Product | System (1) | Type | Cure Time (2) | Thermal Cond. (W/m · K) | Color | Flowability | Feature |
| TIG210BX | TIG | Grease | n.a. | 2.1 | Grey | Non-flowable | Low bleed grease |
| TIG830SP | TIG | Grease | n.a. | 4.1 | Grey | Non-flowable | Screen printable grease |
| TIA216G | AC, 2K | Soft rubber | 30 min @ 70 °C | 1.6 | Grey | Flowable | 8 Pa.s; tacky adhesion; UL94-V0, UL RTI 150 °C |
| TIA222G | AC, 2K | Soft rubber | 30 min @ 70 °C | 2.2 | Grey | Flowable | 20 Pa.s; tacky adhesion; UL94-V0 |
| TIA225GF | AC, 2K | Gap Filler | 30 min @ 70 °C | 2.5 | Grey | Non-flowable | Soft stress-absorbing rubber; can cure at room temp |
| TSE3281-G | AC, 1K | Adhesive | 30 min @ 150 °C | 1.7 | Grey | Flowable | Adhesive |
| XE13-C1862PT | AC, 1K | Adhesive | 30 min @ 150 °C | 2.4 | Grey | Flowable | High elongation; pin transferable |
| XE11-B5320 | CC, 1K | Adhesive | TFT 5 min @ RT | 1.3 | White | Non-flowable | Adhesion at RT |
| TIA0220 | CC, 1K | Adhesive | TFT 10 min @ RT | 2.2 | Grey | Semi-flowable | Adhesion at RT; high thermal conductivity, UL94-V0 |
| TIA0260 | CC, 1K | Adhesive | TFT 10 min @ RT | 2.6 | Grey | Semi-flowable | Adhesion at RT; high thermal conductivity, UL94-V0 |
| TIA350R | AC, 1K | Adhesive | 30 min @ 120 °C | 3.5 | Grey | Semi-flowable | High thermal conductivity |
(1) AC = Addition Cure / CC = condensation Cure / TIG = Thermal Interface Grease (2)TFT = Tack Free Time
Typical data are average data and are not to be ussed as or to develop specifications.
