Protective Silicone Potting & Encapsulation Materials

Momentive Performance Materials provides leading-edge silicone technologies to help meet performance and productivity challenges in a wide range of automotive and electronic applications. Momentive’s dielectric potting and encapsulation materials are principally used to protect electronic components from moisture and harmful contaminants. These materials can help provide stress relief protection to circuits from thermal, vibration, and mechanical stress. Momentive offers a range of materials including one- and two-part products and specialized grades that offer thermal conductivity, flame retardancy, and low volatiles.

Protective Silicone Potting & Enacapsulation MaterialsProtective Silicone Potting & Encapsulation Materials

Typical Physical Properties

(selected grades only; please contact us for material selection support)

(1) AC = Addition Cure, CC = Condensation Cure
(2) Compositionally compliant with the requirements of 21 CFR 177.2600 - Rubber articles intended for repeated use have been found, through testing of a representative sample, to meet the extractives limitations in 21 CFR 177.2600(e) and/or (f). It is the responsibility of the user to determine that the final product complies with the extractive limitations and other requirements of 21 CFR 177.2600 under their specific manufacturing procedures.
NOTE: Typical properties are average data and are not to be used as or to develop specifications.