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Adhesives and Sealants Adhesives & Sealants for Electronics Adhesives & Sealants Products for Electronics

Adhesives & Sealants Products for Electronics

Momentive sealants and adhesives employ leading-edge silicone technologies to help meet performance and productivity challenges in a wide range of electronic applications. Design freedom, long-term performance and productivity needs drive the trend from mechanical assembly to high-speed, automated adhesion.  Meanwhile, more and more components migrate to electronic solutions that require assembly.  Momentive offers silicone sealants and fast cure silicone adhesives for high-productivity assembly, as well as solutions for electronic components that can allow design flexibility and help provide long-term component reliability under harsh operating conditions.

RTV Silicone Products for Aerospace

Silicones for Automotives

Silicones for Electronics


Key Features

  • Primerless adhesion to many substrates
  • Fast cure
  • Long-term elasticity
  • Non-corrosiveness
  • One-component availability
  • Choice of cure systems  

Typical Benefits

  • Broad application 
  • Productivity, high outputs
  • Compensation for CTE mismatch
  • Reduced risk for electronics
  • Ease of use
  • Design flexibility 

Potential Applications 

  • Headlamp assemblies 
  • ECU adhesion
  • Sensor adhesion
  • Wire connector seating
  • HVAC systems 

Typical Physical Properties

(selected grades only; please contact us for material selection support)

Product  Cure (1)  System  Cure Time / Tack Free Time (3)  Color  Flowability  Feature
Addisil* 6101 adhesive sealant  AC  1 part  CT 10 min @ 125 °C   Black  Non-flowable  Fast bonding @ 125 °C  
TSE322  AC  1 part  CT 30 min @ 150 °C   Light blue, Black  Flowable Fast bonding @ T>125 °C 
TSE326M-EX  AC  1 part  CT 1 hr @ 150 °C   Red  Flowable  High heat stability
TN3005   CC   1 part   TFT < 10 min @ RT   Clear, white, black   Non-flowable Tin free/ Fast cure/ Low volatile
TN3305   CC   1 part   TFT < 10 min @ RT   Clear, white, black   Flowable Tin free /Fast cure/ Low volatile
TN3085   CC   1 part   TFT < 10 min @ RT   White, grey   Non-flowable Tin free/ Fast cure/ Low volatile
RTV210A / 224B   CC   2 part (10:1 w/w)   CT 15 min @ RT(2)   Black   Non-flowable   Fast bonding @ ambient 

(1) AC = Addition Cure, CC = Condensation Cure
(2) After 10-30 minutes cure at RT the bond strength is usually sufficient to allow part handling - full cure obtained after 1-3 days at ambient
(3) CT = Cure Time, TFI = Tack Free Time
Typical data are average data and are not to be used as or to develop specifications.
*Addisil is a trademark of Momentive Performance Materials GmbH.

 

RTVs for Aerospace and AviationRTVs for Aerospace and Aviation

Silicones in Adhesives and SealantsSilicones in Adhesives and Sealants

Aerospace and Aviation InfographicAerospace and Aviation Infographic
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* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.