SILCOOL™ Thermally Conductive Grease Compounds for ICT
Momentive’s SILCOOL thermally conductive grease compounds help to achieve very low thermal resistance and operating temperature stability. The combination of printability, thermal performance in the application, and temperature stability makes them good candidates for thermal interface applications in a range of ICT industry applications.
- Featured product key characteristics:
- Electrically insulative
- Solvent-free
- Dry-out resistant
- Thermal Resistance stability
- Screen and stencil printing compatible
| Product Name | Thermal Conductivity (W/m.K) | Thermal Resistance (cm2.K/W) | Minimum BLT | Feature |
|---|---|---|---|---|
| (μm) | ||||
| SILCOOL™ TIG4090 | 3.3 | 0.025 | 7 | Very thin BLT. Lowest thermal resistance for controlled tolerance designs. |
| SILCOOL TIG4070 | 4.2 | 0.038 | 10 | Thin BLT combined with higher bulk thermal conductivity. |
| SILCOOL TIG3500H | 3.5 | 0.1 | 25 | Heat resistance at typical assembly thicknesses |
| SILCOOL TIS720 | 7 | 0.042 | 30 | Reactive type printable compound |
