SILCOOL™ Thermal Interface Materials
In response to new heat-management challenges presented by higher frequencies and power, and increased miniaturization of today’s electronic devices, Momentive scientists have developed and continue to enhance our SILCOOL thermal interface materials. The excellent thermal conductivity and consistent, long-term heat transfer performance provided by SILCOOL products can enable such devices to operate more efficiently and reliably. Our complete SILCOOL product portfolio, which includes grease compounds, adhesives, encapsulants and potting compounds, and liquid dispensed thermal pads, also offers excellent workability, thin bond lines and minimal weight loss at elevated temperatures.
Along with excellent thermal conductivity, SILCOOL grease compounds offer low bleed as well as great stability, penetration and temperature resistance. The combination of processing performance and thermal conductivity exhibited by these grease compounds, make them particularly attractive candidates for high-performance devices and packages.
Quick-curing SILCOOL silicone adhesive products can allow thin bond lines that will generally contribute to low thermal resistance, as well as provide excellent adhesion and reliability. They can adhere well to ceramics, glass and most metals (including aluminum, copper and nickel plate), without the use of primers, and without causing corrosion to most metal substrates. In addition, SILCOOL silicone adhesive products offer excellent adhesion to many high-performance thermoplastics, such as PPS and PBT.
SILCOOL silicone potting compounds, encapsulants and liquid dispensed thermal pads include a variety of heat and room temperature cure materials. Low-viscosity grades are available for potting applications, and moderate-viscosity grades can provide the necessary dispensing stability for bead formulation. Forming a stress-relieving rubber, these SILCOOL grades can also be considered for use as gap fillers or as liquid-dispensed alternatives to thermal pads.
The highly workable nature of SILCOOL products can help effectively accommodate automated dispensing, screen printing and stamping. SILCOOL silicone products are excellent candidates for electronic and other applications where thermal management and high-heat transfer are critical.
The SILCOOL brand of thermal interface materials is used across many industries, such as energy, power, utilities, telecom, microelectronics, aerospace, automotive, renewable energy, consumer electronics and health care. Potential applications include assembly adhesion, board assembly and manufacturing of flat-panel monitors, photovoltaic components and hybrid car parts.
Discover how products in the versatile SILCOOL brand can meet thermal management objectives.
* SILCOOL is a trademark of Momentive Performance Materials Inc.
SILCOOL* TIA0220 neutral alkoxy cure adhesive offers high thermal conductivity and can cure without heat, making it an ideal candidate for a variety of electronic applications.
SILCOOL TIA141GF is a dispensable, 1-component, pre-cured thermal gap filler. Its non-slump characteristics after dispense can provide physical stability to retain shape until assembly, and since it is a dispensable material, TIA141GF flows can conform to complex designs and non-uniform thicknesses of assemblies at minimized assembly pressures.
SILCOOL TIA208R-HF is a 2-component, thermally conductive highly flowable potting material. When cured at room temperature or quickly with heat, it cures to a thermally conductive rubber that adheres well to most metal and plastic substrates without the need for primers.
SILCOOL TIA208RL is a two-component, thermally conductive material for potting. The flowability of TIA208RL allows it to be potted and conform to complex 3-dimenstional shapes and cavities, filling voids and thereby creating a thermal path to remove heat. TIA208RL can be cured at room temperature or quickly with heat.
SILCOOL TIA211G is a 2-component, thermally conductive potting material.
SILCOOL™ TIA219R and TIA219RP thermal potting silicones are two-component, thermally conductive materials typically used for potting and gap filling. When cured at room temperature or quickly with heat, they cure to a thermally conductive rubber and adhere well to various types of materials such as metals, plastics, glass and ceramics, without the use of primers. TIA219RP is the prolonged pot life version of TIA219R.
SILCOOL TIA225GFB-25 gap filler is a 2-component, soft, thermally conductive silicone material that can help to dissipate heat from electronic devices.
Learn more about SILCOOL* TIA241GF, a 2-component, thermally conductive silicone for dissipating heat in your electronics applications.
SILCOOL TIA268GF silicone is a 2-component, soft, thermally conductive material that can dissipate heat from electronic devices. Its non-slumping pasty consistency can provide physical stability for optimized processing.
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