Thermally Conductive Silicone Adhesives

Back to Thermal Management Silicones

Momentive Performance Materials family of SilCool thermally conductive adhesives can help deliver thin bond lines that contribute to low thermal resistance, and provide excellent adhesion and reliability. This series of heat-cured adhesives excel in thermal interface applications that demand good structural adhesion. Examples include spreaders and heat generators, and thermal interfaces to heat sinks in TIM2 applications.

Other thermal adhesives from Momentive offer the process convenience of 1-part condensation cure with moderate heat dissipation. Potential applications include board assemblies and sealants in power modules and sensors.

SilCool* Silicone Adhesive - Addition Cure

The SilCool series silicone adhesives from Momentive Performance Materials offer 1-part, heat curable materials that bond well to a wide variety of substrates without the need for primers. They offer outstanding thermal conductivity, low thermal resistance, excellent dielectric properties, and low stress. SilCool adhesives are excellent candidates for applications presented with  heat management challenges that arise from the higher frequencies, power, and miniaturization in today’s electronic devices. Able to efficiently conduct heat, these materials have shown to be valuable additions to semiconductor packages that incorporate heat generating chips, heat spreaders, and heat sinks (TIM1 & TIM2).

Key Features and Typical Benefits

• High workability – to help meet the demands of automated dispensing, screen printing, and stamping applications
• Fast cure & good adhesion
• High thermal conductivity
• Low thermal resistance
• Wide operating temperature range
• Compatible  with high-temperature lead-free processing
• Minimal ionic impurities & excellent dielectric properties
  
   

Product Details

¹Hot wire method, ²Laser flash analysis on Si-Si sandwiched material, ³Ion chromotography analysis on water extracts *⁴ Impressed voltage: 100V Typical properties are average data and are to be used as or to develop specifications.

(Charts) Thermal Resistance is proportional to the thickness of the material through which the heat must travel. Increases in pressure during the component assembly process are known to contribute to reductions in thickness of the thermal interface (BLT), and subsequently, reduced thermal resistance.

(Above) Test Conditions: Sandwich material between 10mm×10mm silicon dies, and cure for 1 hour at 150°C. Measure thermal resistance using laser flash method.

(Above) Test Conditions: Sandwich material between 10mm×10mm silicon dies, assemble at 500kPa and cure at 150°C for 1 hour. Thermal cycle (-55°C~150°C, dwell time 30 minutes at each extreme). Measure thermal resistance using laser flash method.

(Above) Test Conditions: Sandwich material between 10mm×10mm silicon dies, assemble at 500kPa and cure at 150^oC for 1 hour. High temperature / humidity test (85°C, 85%RH, 250, 500, 750, 1000 hours). Measure thermal resistance using laser flash method.

Silicone Adhesive - Condensation Cure

Momentive Performance Materials offers a range of thermally conductive condensation cure adhesives and sealants. These materials cure to form an elastic rubber when exposed to atmospheric moisture at room temperatures, eliminating the need for heat ovens. The result is a unique combination of process efficiency and excellent thermal conductivity. Our condensation-cure adhesives and sealants are commonly applied in board assembly and sensor applications that require moderate thermal management performance and ease of use.

Product Details

¹Hot wire method, ²Laser flash analysis on Si-Si sandwiched material Typical property data values should not be used as specifications